Bisphenol A Epoxy Resin Cas 1675-54-3

 2,2 - Bis-(4-glycidyloxybenzene) propane (CAS number: 1675-54-3), also known as Bisphenol A Diglycidyl Ether (Bisphenol A DGEBA or BADGE), is an important epoxy resin monomer and is widely used in coatings, adhesives, electronic packaging and other fields. The following is a comprehensive information summary based on publicly available online resources: 

I. Basic Chemical Information

Molecular Structure and Properties

Molecular Formula: C₂₁H₂₄O₄

Molecular Weight: 340.41

Appearance: Colorless to pale yellow transparent liquid

Density: 1.2 ± 0.1 g/cm³, Boiling Point: 487.0 ± 35.0°C, Melting Point: 40 - 44°C, Flash Point: 148.5 ± 32.8°C

Solubility: Insoluble in water, soluble in organic solvents.

Aliases and CAS Number

Chinese Alias: Bisphenol A diglycidyl ether, DGEBA, DER 332, etc.

English Alias: Bisphenol A diglycidyl ether (BADGE), DGEBA, DER 332, etc.

CAS Number: 1675-54-3. 

II. Product Information and Suppliers

Main Suppliers

Domestic Suppliers: Shandong Deshang (industrial grade, 99% purity, 1kg minimum order), Jiangsu Runfeng Synthetic Technology (research reagents, 85% GC purity), Hubei Jusheng Technology (industrial production, 99% purity), Beijing Solab Technology (epoxy resin E42 type), Yinjie Chemicals (200kg per barrel, 99% purity, price 25 yuan/kg in October 2025).

International Suppliers: Sigma-Aldrich, Alfa Aesar (technical 80% purity, 25g price 218 yuan), TCI Shanghai (>85% GC purity).

Packaging and Prices

Industrial grade: Usually supplied in 25kg or 200kg barrels, price range is 25-80 yuan/kg (data as of 2025, decreases with order quantity).

Research grade: 500g packaging price is approximately 400-3195 yuan, purity is mostly 85%-99%. 

III. Application Fields

Coatings and Adhesives

Used for preparing anti-corrosion coatings, food canning coatings, insulating paints, etc., with excellent chemical resistance and adhesion.

As the main component of structural adhesives, widely used for bonding metals, plastics, glass, etc.

Electronic and Electrical Industry

Used in semiconductor packaging, PCB laminating, insulation encapsulation, etc., providing high strength and moisture resistance and heat resistance.

Typical models include epoxy resin E44 (6101), E51 (618), etc.

Composite Materials and Engineering Plastics

React with curing agents (such as amines, acid anhydrides) to form thermosetting resins, used for manufacturing carbon fiber composite materials, automotive parts, aerospace structural components.

Biomedical Field

Used as a drug carrier material in patents. For example, when mixed with polyepoxypropyl triamine (Jeffamine T403), it modifies mica two-dimensional nanosheets for targeted delivery of cancer treatment drugs.

Note the potential biological toxicity and need to strictly control the residual amount. 

IV. Safety and Regulatory Information

Hazard Classification

Health Hazards: Skin contact may cause irritation and allergies (H315, H317).

Environmental Hazards: Toxic to aquatic organisms and may cause long-term ecological impacts.

Carcinogenicity: The World Health Organization International Agency for Research on Cancer (IARC) classifies it as a Group 3 carcinogen (2017).

Regulations and Standards

EU REACH Regulation: Not classified as a substance of very high concern (SVHC), but must comply with the safety data sheet requirements of REACH Appendix II.

Food Contact Materials: EU Regulation (EC) No 1895/2008 limits its migration amount to ≤0.05 mg/kg (food simulants), and the 2023 proposal intends to further tighten it to 0.02 mg/kg.

Domestic Standards: GB/T 13657-2011 stipulates the technical requirements and test methods for epoxy resins.

V. Synthesis Methods and Processes

Traditional One-step Method

Using bisphenol A (BPA) and epichlorohydrin (ECH) as raw materials, a ring-opening and ring-closing reaction is carried out under the catalysis of NaOH. The optimal conditions are: n (ECH)/n (BPA) = 10:1, NaOH concentration 30%, reaction temperature 75°C, with a yield of up to 80.1%.

Chlorine-Free Synthesis Process

Using phosphotungstophosphoric acid quaternary ammonium salt as the catalyst, the diisopropyl ether of bisphenol A reacts with hydrogen peroxide to avoid the formation of organic chlorine impurities, resulting in lower viscosity and better performance of the product.